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Home » Market Update » ECIA – Expect lead times to broaden

EP&T is reporting on the recent analysis by the ECIA (Electronic Component Industry America) on lengthening chip lead times across a broad range of electronic components.

While the full analysis is available to ECIA members, they’ve kindly provided a summary of recently compiled data which includes these highlights:

  • Insufficient investment in 200 mm wafers is causing widespread problems across many markets.
  • Demand for 200mm components including IoT and 5G chips, analog processors, power management devices, MEMS devices, image sensors, etc, continues to grow while 200mm capacity has become constrained.
  • As demand for automotive electronics has rebounded, the shortage of chips produced on 200mm wafers has become much more acute. The typical car requires anywhere from 50 to 150 semiconductors.

The complete report includes insights from Len Jelinek, widely recognized as one of the world’s foremost authorities on semiconductor manufacturing issues.

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